Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer
暂无分享,去创建一个
Muhannad S. Bakir | Gary S. May | Hanju Oh | M. Bakir | Li Zheng | Yue Zhang | Hanju Oh | G. May | Yue Zhang | Li Zheng
[1] Y. Peles,et al. Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies , 2009 .
[2] A. Koşar,et al. Laminar Flow Across a Bank of Low Aspect Ratio Micro Pin Fins , 2005 .
[3] H. Rothuizen,et al. Interlayer cooling potential in vertically integrated packages , 2008 .
[4] Muhannad S. Bakir,et al. Silicon Micropin-Fin Heat Sink With Integrated TSVs for 3-D ICs: Tradeoff Analysis and Experimental Testing , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[5] R. Pease,et al. High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.
[6] Li Zheng,et al. 3-D Stacked Tier-Specific Microfluidic Cooling for Heterogeneous 3-D ICs , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[7] Yusuf Leblebici,et al. Integration of intra chip stack fluidic cooling using thin-layer solder bonding , 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).
[8] Kaustav Banerjee,et al. Multiple Si layer ICs: motivation, performance analysis, and design implications , 2000, Proceedings 37th Design Automation Conference.
[9] Muhannad S. Bakir,et al. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation , 2008, 2008 IEEE Custom Integrated Circuits Conference.
[10] Dong Liu,et al. Experimental study on liquid flow and heat transfer in micro square pin fin heat sink , 2011 .
[11] A. Koşar,et al. Forced convective heat transfer across a pin fin micro heat sink , 2005 .
[12] A. Zukauskas. Heat Transfer from Tubes in Crossflow , 1972 .
[13] Kaustav Banerjee,et al. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration , 2001, Proc. IEEE.
[14] Yildiz Bayazitoglu,et al. Optimization of short micro pin fins in minichannels , 2012 .
[15] R. Prasher,et al. Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid , 2007 .
[16] Yogendra Joshi,et al. Enhancement in CMOS chip performance through microfluidic cooling , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.
[17] S. Kandlikar,et al. SINGLE-PHASE LIQUID HEAT TRANSFER IN PLAIN AND ENHANCED MICROCHANNELS , 2006 .