论文信息 - Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

The FDTD and MRTD full-wave numerical techniques are applied to the modeling and analysis of embedded components, such as MEMS, in silicon packages. Preliminary design rules are derived for minimized-crosstalk transmission lines, for a wideband compact transition, for a MEMS switch and that can be used in practical tuning applications and for a packaging adaptive antenna.

[1] J. Laskar,et al. RF-system-on-package (SOP) for wireless communications , 2002, IEEE Microwave Magazine.

[2] Allen Taflove,et al. Computational Electrodynamics the Finite-Difference Time-Domain Method , 1995 .

[3] J. Papapolymerou,et al. Coupling between microstrip lines with finite width ground plane embedded in polyimide layers for 3D-MMICs on Si , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[4] B. McGarvey,et al. Adaptive Numerical Modeling of RF Structures Requiring the Coupling of Maxwell ' s , Mechanical and Solid-State Equations , 2000 .

[5] Manos M. Tentzeris,et al. Modeling and design of RF MEMS structures using computationally efficient numerical techniques , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[6] Kyutae Lim,et al. Design of compact stacked-patch antennas on LTCC technology for wireless communication applications , 2002, IEEE Antennas and Propagation Society International Symposium (IEEE Cat. No.02CH37313).