Stress analysis of extensively and partially soldered optical components

Abstract Resistance soldering of optical components is an upcoming technology following the trends towards automation and miniaturization with particularly high relevance for high optical power applications. A stress analysis is necessary in order to qualify this technology with regard to the component's optical behavior and its long-term stability. Analytical and FEM-simulative calculations are used to estimate the stresses within the optical element and the solder layer for extensively soldered components. Furthermore partially soldered components are being simulated and optically evaluated using polarization microscopy. To evaluate the long-term stability of the compound multiple series of thermal cycling were performed.