Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

The interfacial reaction and intermetallic formation at the interface between tin solders containing a small amount of copper with platinum were investigated in this study. Sn-0.7Cu and Sn-1.7Cu solders were reacted with platinum by dipping Pt/Ti/Si specimens into the molten solder at 260°C. Sn-3.8Ag-0.7Cu solder was reacted with platinum by reflowing solder paste on a Pt/Ti/Si substrate at 250°C. PtSn4 intermetallic formed in all specimens while Cu6Sn5 interfacial intermetallic was not observed at the solder/platinum interfaces in any specimens. A parabolic relationship existed between the thickness of the Pt-Sn intermetallic and reaction time, which indicates the intermetallic formation in the solder/platinum interface is diffusion controlled.

[1]  Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process , 2003 .

[2]  Wen-Tai Chen,et al.  Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders , 2002 .

[3]  R. A. Fournelle,et al.  An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates , 1999 .

[4]  Jin Yu,et al.  Creep rupture of lead-free Sn-3.5Ag-Cu solders , 2003 .

[5]  Sung K. Kang,et al.  Lead (Pb)-free solders for electronic packaging , 1994 .

[6]  K. N. Subramanian,et al.  Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging , 1999 .

[7]  B. Meagher,et al.  Compound growth in platinum/tin-lead solder diffusion couples , 1996 .

[8]  F. Yin,et al.  Thermodynamic assessment of the Pt–Sn system , 2001 .

[9]  R. Boudreau.  Foreword contributions from the 50th electronic components and technology conference , 2001 .

[10]  Peter Borgesen,et al.  The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure , 2001 .

[11]  S. Wang,et al.  Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization , 2003 .

[12]  M. Abtew,et al.  Lead-free Solders in Microelectronics , 2000 .

[13]  King-Ning Tu,et al.  Fast dissolution and soldering reactions on Au foils , 1998 .