Failure Analysis of Adhesively Bonded Structures: From Coupon Level Data to Structural Level Predictions and Verification
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Anthony M. Waas | Raymond G. Boeman | Jaeung Chung | Vlastimil Kunc | Khaled W. Shahwan | A. Waas | V. Kunc | K. Shahwan | J. Schroeder | R. Boeman | Lynn B. Klett | Xie | Jessica A. Schroeder | L. Klett | Jaeung Chung
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