Control and Monitoring of Semiconductor Manufacturing Processes: Challenges and Opportunities

Abstract The semiconductor industry is going through a technology transition from 200mm to 300mm wafers to improve manufacturing efficiency and reduce manufacturing cost per chip. These technological changes present a unique opportunity to optimally design the process control systems for the next generation fabs. In this paper we first propose a hierarchical fab-wide control framework with the integration of 300mm equipment and metrology tools and highly automated material handling system. Relevant existing run-to-run technology is reviewed and analyzed in the fab-wide control context, process and metrology data monitoring are discussed with an example, and missing components are pointed out as opportunities for future research and development. Concluding remarks are given at the end of the paper.

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