A thermal model for a multichip device with changing cooling conditions

This paper describes the development of a thermal model for a multichip device cooled by a force cooled heatsink employing fan speed control. The model can be used to estimate the temperature of a device in a system where the thermal coupling between devices is significant and the characteristics of the heatsink are altered by the fan speed. The model is developed for a simplified experimental test configuration and is verified against practical results.