论文信息 - Thin glass based photonic and electronic assemblies

Thin glass based photonic and electronic assemblies

Electronics industry has been very successful in finding size and cost economic packaging forms and strategies. Such standardized packages have not been established for embedding optical or electrical-optical chips, yet. This short proceedings article summarizes some photonic and electronic-photonic assembly realizations and packaging concepts currently pursued at Fraunhofer IZM, in an collaboration with Technical University Berlin.

Henning Schröder | Daniel Weber | Martin Schneider-Ramelow | Gunnar Böttger | Wojciech Lewoczko-Adamczyk

[1] R. Aschenbrenner,et al. Panel Level Packaging - A View Along the Process Chain , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

[3] H. Schröder,et al. Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy , 2018, OPTO.