Structural Feature-Based Fault-Detection Approach for the Recipes of Similar Products

The sensor signals (i.e., data streams of process parameters) of semiconductor processes exhibit nonlinear, multimodal trajectories with some common structural features. In this paper, we propose a process fault-detection approach based on the structural features of the sensor signals, such as the geometric shape, length, and height. The approach aims at constructing a shared univariate model and a multivariate model. The shared univariate model is set up for individual process parameters and clusters the process recipes of similar products. The result is a tree where the leaf nodes and intermediate nodes correspond to individual recipes and feature-based fault-detection criteria, respectively. The recipes with the same parent nodes share the criteria specified in the nodes. On the other hand, the multivariate model is constructed for a process recipe. It builds a Hotelling's T 2 that considers the correlations between the signal structures of the process parameters. We demonstrated that the test results of the two models using the data collected from a work-site etch process were encouraging.

[1]  C. Schmidt,et al.  Fault detection for a via etch process using adaptive multivariate methods , 2005, IEEE Transactions on Semiconductor Manufacturing.

[2]  Zhengguang Xu,et al.  Shape and Structural Feature Based Ear Recognition , 2004, SINOBIOMETRICS.

[3]  Ranjan Ganguli,et al.  Trend Shift Detection in Jet Engine Gas Path Measurements Using Cascaded Recursive Median Filter With Gradient and Laplacian Edge Detector , 2004 .

[4]  S.J. Qin,et al.  Multiblock principal component analysis based on a combined index for semiconductor fault detection and diagnosis , 2006, IEEE Transactions on Semiconductor Manufacturing.

[5]  S. Joe Qin,et al.  Statistical process monitoring: basics and beyond , 2003 .

[6]  Yon-Chun Chou,et al.  A methodology for product mix planning in semiconductor foundry manufacturing , 2000 .

[7]  Emily K. Lada,et al.  A wavelet-based procedure for process fault detection , 2002 .

[8]  Jin Wang,et al.  Fault Detection Using the k-Nearest Neighbor Rule for Semiconductor Manufacturing Processes , 2007, IEEE Transactions on Semiconductor Manufacturing.

[9]  Costas J. Spanos,et al.  Real time statistical process control for plasma etching , 1991, 1991 Proceedings IEEE/SEMI International Semiconductor Manufacturing Science Symposium.

[10]  Peter W. M. John Statistical Methods in Engineering and Quality Assurance , 1990 .

[11]  Carl Tim Kelley,et al.  Iterative methods for optimization , 1999, Frontiers in applied mathematics.

[12]  H. Yue,et al.  Fault detection of plasma etchers using optical emission spectra , 2000 .

[13]  Roy E. Welsch,et al.  Multivariate Statistical Process Control and Signature Analysis Using Eigenfactor Detection Methods , 1999 .

[14]  Emmanuel Skordalakis,et al.  Syntactic Pattern Recognition of the ECG , 1990, IEEE Trans. Pattern Anal. Mach. Intell..

[15]  P. A. Taylor,et al.  Synchronization of batch trajectories using dynamic time warping , 1998 .

[16]  Cheng-Ching Yu,et al.  Control relevant issues in semiconductor manufacturing : Overview with some new results , 2007 .

[17]  B. Flinchbaugh,et al.  Monitoring and diagnosis of plasma etch processes , 1988 .

[18]  Mitchell H. Gail,et al.  Critical Values for the One-Sided Two-Sample Kolmogorov-Smirnov Statistic , 1976 .

[19]  Masafumi Hagiwara,et al.  Large scale on-line handwritten Chinese character recognition using improved syntactic pattern recognition , 1997, 1997 IEEE International Conference on Systems, Man, and Cybernetics. Computational Cybernetics and Simulation.