论文信息 - Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder

Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder

Abstract We report on three-dimensional (3D) microstructure visualization and finite-element method modeling of deformation in Sn–3.5Ag alloy. The 3D virtual microstructure accurately represented the alignment, aspect ratio, and distribution of the Ag 3 Sn second phase. The 3D microstructure-based approach is more accurate than unit cell models for simulating and understanding material behavior.

R. S. Sidhu | Nikhilesh Chawla | N. Chawla | R. Sidhu

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