A Closed-Form Analytical Transient Response Model for On-Chip Distortionless Interconnect

This paper presents a closed-form analytical transient response model for an on-chip distortionless interconnect considering resistance/capacitance loads via solving a semi-infinite transmission line equation. As verified by the simulation results, this transient response model has high accuracy, which could be used to derive the characteristics of the transmitted signal for facilitating the design of the distortionless interconnect. Based on the model, the steady-state output voltage and the delay related to the interconnect have been analyzed.

[1]  Masanori Hashimoto,et al.  Analytical Eye-diagram Model for On-chip Distortionless Transmission Lines and Its Application to Design Space Exploration , 2007, 2007 IEEE Custom Integrated Circuits Conference.

[2]  R. Montoye,et al.  Beyond Moore's Law: the interconnect era , 2004, Computing in Science & Engineering.

[3]  Rui Shi,et al.  Approaching Speed-of-light Distortionless Communication for On-chip Interconnect , 2007, 2007 Asia and South Pacific Design Automation Conference.

[4]  James D. Meindl,et al.  Compact distributed RLC interconnect models - part III: transients in single and coupled lines with capacitive load termination , 2003 .

[5]  Rui Shi,et al.  Surfliner: a distortionless electrical signaling scheme for speed of light on-chip communications , 2005, 2005 International Conference on Computer Design.

[6]  James D. Meindl,et al.  Compact distributed RLC interconnect models - part IV: unified models for time delay, crosstalk, and repeater insertion , 2003 .

[7]  Payman Zarkesh-Ha,et al.  Interconnect opportunities for gigascale integration , 2002, IBM J. Res. Dev..

[8]  K. Masu,et al.  On-chip transmission line for long global interconnects , 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

[9]  James D. Meindl,et al.  Compact distributed RLC interconnect models. I. Single line transient, time delay, and overshoot expressions , 2000 .

[10]  Oliver Heaviside Electrical Papers: ELECTROMAGNETIC INDUCTION AND ITS PROPAGATION (SECOND HALF.) , 2011 .

[11]  James D. Meindl,et al.  Compact distributed RLC interconnect models-Part II: Coupled line transient expressions and peak crosstalk in multilevel networks , 2000 .

[12]  Kaustav Banerjee,et al.  Interconnect limits on gigascale integration (GSI) in the 21st century , 2001, Proc. IEEE.

[13]  Chung-Kuan Cheng,et al.  Distortion Minimization for Packaging Level Interconnects , 2006, 2006 IEEE Electrical Performane of Electronic Packaging.

[14]  Takayasu Sakurai,et al.  Closed-form expressions for interconnection delay, coupling, and crosstalk in VLSIs , 1993 .