Abstract A new experimental method for detecting solder joint strain in package assemblies using digital image correlation metrology has been developed. A new methodology is proposed which utilizes strain data generated by this technique for predicting solder joint fatigue life for any desired package configuration based on a reference configuration. This approach has significant practical appeal since it obviates brute-force temperature cycle testing for the qualification of every new variation of an existing package configuration. In this paper, we describe the principle, experimental set-up and sample preparation techniques for this method. We present typical strain data on solder joints for a ball grid array (BGA) package mounted to a FR4 PC board. We apply the technique to the prediction of temperature cycling reliability of a Ceramic BGA package wherein, the effect of a new substrate material is examined and the predictions are confirmed based on empirical temperature cycle testing data. Finally, we show a co-relation of measured strain data with computations by finite element modeling performed for a specific package configuration.
[1]
P. A. Totta,et al.
SLT device metallurgy and its monolithic extension
,
1969
.
[2]
W. Peters,et al.
Digital Imaging Techniques In Experimental Stress Analysis
,
1982
.
[3]
Bongtae Han,et al.
Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
,
1996
.
[4]
M. Kokubu,et al.
The application of HITCE ceramic material for LGA-type chip scale package
,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[5]
Keith C. Norris,et al.
Reliability of controlled collapse interconnections
,
1969
.