论文信息 - Simulation of an integrated PCM–wallboard system

Simulation of an integrated PCM–wallboard system

Heat transfer barriers and other practical difficulties do currently hamper the development and application of (phase change materials) PCM–wallboard systems. In this study thermal performance of randomly mixed PCM and laminated PCM–wallboard systems have been numerically evaluated and results compared. The laminated system displayed up to 50% increment in heat flux enhancement and about 18% increase in heat transfer rates. Consequently, the laminated PCM–wallboard system has greater potential for heating and cooling application in buildings than the randomly mixed system. Experimental validation and investigation into manufacturing techniques are however needed to establish the commercial viability. Copyright © 2002 John Wiley & Sons, Ltd.

K Darkwa | J.-S. Kim

[1] Helmut E. Feustel,et al. Thermal Performance of Phase Change Wallboard for Residential Cooling Application , 1997 .

[2] K Darkwa. Mathematical Evaluation of Phase Change Wall Systems: for Reducing Energy Consumption in Buildings and CO2 Emissions in the United Kingdom , 2000 .

[3] E. Sparrow,et al. Handbook of Numerical Heat Transfer , 1988 .

[4] K Darkwa. Evaluation of an encapsulated neuron-composite phase change material (PCM) for drywall system , 2001 .

[5] D. Y. Goswami,et al. Solar thermal energy storage in phase change materials , 1992 .

[6] K Darkwa. Evaluation of regenerative phase change drywalls: low energy buildings application , 1999 .

[7] R. Velraj,et al. Heat transfer enhancement in a latent heat storage system , 1999 .