Thermal resistance investigations on new leadframe-based LED packages and boards
暂无分享,去创建一个
Jiri Jakovenko | Xavier Jordà | X. Perpiñà | Miquel Vellvehí | B. Pardo | R. J. Werkhoven | P. Bancken | A. Gasse | A. Fargeix | T. Van Weelden
[1] Sung Yi,et al. Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package , 2008, 2008 58th Electronic Components and Technology Conference.
[2] E. Fred Schubert,et al. Junction temperature in light-emitting diodes assessed by different methods , 2005, SPIE OPTO.
[3] Peter Micah Sandvik,et al. Optimization of current spreading metal layer for GaN/InGaN-based light emitting diodes , 2002 .
[4] Hyun-Ho Kim,et al. Thermal transient characteristics of die attach in high power LED PKG , 2008, Microelectron. Reliab..
[5] Kai Wang,et al. Status and prospects for phosphor-based white LED packaging , 2009 .
[6] H Ribot,et al. Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation , 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
[7] P. Lipinski,et al. Multi-site micromechanical modelling of thermo-elastic properties of heterogeneous materials , 2012 .
[8] J. W. Meredith,et al. Microelectronics reliability , 1988, IEEE Region 5 Conference, 1988: 'Spanning the Peaks of Electrotechnology'.
[9] M. Rencz,et al. Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities , 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).
[10] Marta Rencz,et al. Measuring partial thermal resistances in a heat-flow path , 2002 .
[11] X. Jordà,et al. Irradiance-based emissivity correction in infrared thermography for electronic applications. , 2011, The Review of scientific instruments.
[12] E. Schubert,et al. Junction–temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method , 2004 .
[13] Jiansen Zhu,et al. Global/local modeling for PWB mechanical loading , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[14] X. Perpina,et al. Power-Substrate Static Thermal Characterization Based on a Test Chip , 2008, IEEE Transactions on Device and Materials Reliability.
[15] V. Székely,et al. Fine structure of heat flow path in semiconductor devices: a measurement and identification method , 1988 .
[16] Frank Wall,et al. Packaging challenges of high-power LEDs for solid state lighting , 2003 .
[17] M. Craford,et al. Status and Future of High-Power Light-Emitting Diodes for Solid-State Lighting , 2007, Journal of Display Technology.
[18] Moo Whan Shin. Thermal design of high-power LED package and system , 2006, SPIE/OSA/IEEE Asia Communications and Photonics.
[19] Lianqiao Yang,et al. Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages , 2006 .