An effective secondary electron emission suppression treatment for copper MDC electrodes

Untreated oxygen-free, high-conductivity (OFHC) copper, commonly used for MDC electrodes, exhibits relatively high secondary electron emission characteristics. This paper describes a specialized ion-bombardment procedure for texturing copper surfaces which sharply reduces the emission properties relative to untreated copper. The resulting surface is a particle-free, robust, uniformly highly-textured all-metal structure. The use of this process requires no modifications to copper machining, brazing, or other MDC normal fabrication procedures. The flight TWT for a planned NASA deep space probe, the Cassini Mission, will incorporate copper MDC electrodes treated with the method described here.<<ETX>>