论文信息 - Development of SiC Chip Based Power Package for High Power and High Performance Application - 字舞流文

Development of SiC Chip Based Power Package for High Power and High Performance Application

T. Lim | Xiaowu Zhang | Zhaohui Chen | G. Tang | T. Chai | L. C. Wai | Yong Liang Ye | R. Singh | B. L. Lau | L. Bu | Kazunori Yamamoto | L. Wai