This paper describes the design process and performance of the optimized parallel optical transmission module. Based on 1×12 VCSEL (Vertical Cavity Surface Emitting Laser) array, we designed and fabricated the high speed parallel optical modules. Our parallel optical module contains a 1×12 VCSEL array, a 12 channel CMOS laser driver circuit, a high speed PCB (Printed Circuit Board), a MT fiber connector and a packaging housing. The L-I-V characteristics of the 850nm VCSEL was measured at the operating current 8mA, 3dB frequency bandwidth more than 3GHz and the optical output 1mW. The transmission rate of all 12 channels is 30Gbit/s, with a single channel 2.5Gbit/s. By adopting the integration of the 1×12 VCSEL array and the driver array, we make a high speed PCB (Printed Circuit Board) to provide the optoelectronic chip with the operating voltage and high speed signals current. The LVDS (Low-Voltage Differential Signals) was set as the input signal to achieve better high frequency performance. The active coupling was adopted with a MT connector (8° slant fiber array). We used the Small Form Factor Pluggable (SFP) packaging. With the edge connector, the module could be inserted into the system dispense with bonding process.
[1]
Richard F. Carson,et al.
Low-power, parallel photonic interconnections for multi-chip module applications
,
1995,
1995 Proceedings. 45th Electronic Components and Technology Conference.
[2]
H. Kosaka.
Smart integration and packaging of 2D VCSEL's for high-speed parallel links
,
1999
.
[3]
K. Shore,et al.
Effect of detuned DBRs on modal gain in VCSELs
,
2000
.
[4]
Paul Fortier,et al.
Packaging aspects of the Litebus/sup TM/ parallel optoelectronic module
,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[5]
J. Cunningham,et al.
A 36-channel parallel optical interconnect module based on optoelectronics-on-VLSI technology
,
2003
.