Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
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Emeka H. Amalu | M. O. Alam | Sabuj Mallik | Ndy N. Ekere | R. S. Bhatti | Kenny C. Otiaba | Mathias Ekpu | Nduka Nnamdi (Ndy) Ekere | S. Mallik | E. Amalu | M. Ekpu | R. Bhatti | K. Otiaba | M. Alam
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