论文信息 - Investigations of an Influence of the Assembling Method of the Die to the Case on Thermal Parameters of IGBTs - 字舞流文

Investigations of an Influence of the Assembling Method of the Die to the Case on Thermal Parameters of IGBTs

P. Górecki | E. Brzozowski | K. Górecki | M. Guziewicz | R. Kisiel | J. Bar