Silicon nitride deposited by direct photolysis of NH/sub 3/ and SiH/sub 4/ at 185 nm and its application to InP MISFETs

The preparation of high quality silicon nitride films by direct photolysis of NH/sub 3/-SiH/sub 4/ at low temperature and their deposition onto InP substrates are discussed. The atomic composition of the films is determined by nuclear analysis. In order to optimise bulk and interface properties quasi-static I(V) and C(V) characteristics measurements were performed on MIS diodes at 1 MHz. At 250 degrees C, a critical field of 4 MV/cm and a resistivity of 6*10/sup 15/ Omega -cm are observed. For annealed samples. a density of states of 4*10/sup 11/ cm/sup -2/ eV/sup -1/ is determined by Terman analysis. The fabrication of a preliminary InP depletion mode MISFET without a recess and N/sup +/ contact layer is described.<<ETX>>