An Overview of Reliability and Failure Mode Analysis of Microelectromechanical Systems (MEMS)
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[1] B. F. Hampton,et al. Assessing the risk of failure due to particle contamination of GIS using the UHF technique , 1994 .
[2] King-Ning Tu,et al. Current-crowding-induced electromigration failure in flip chip solder joints , 2002 .
[3] M. Roukes,et al. Stiction, adhesion energy, and the Casimir effect in micromechanical systems , 2001 .
[4] O. Millet,et al. Reliability of packaged MEMS in shock environment: crack and striction modeling , 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.
[5] Kun Lian,et al. Temperature Effects on Microstructural Evolution and Resulting Surface Mechanical Properties of Ni-Based MEMS Structures , 2003, SPIE MOEMS-MEMS.
[6] J. O. Suh,et al. Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature , 2005 .
[7] A. Varvani-Farahani,et al. Silicon MEMS components: a fatigue life assessment approach , 2005 .
[8] David C. Look,et al. Introduction and recovery of point defects in electron-irradiated ZnO , 2005 .
[9] Andreas A. Polycarpou,et al. Adhesion and Pull-Off Forces for Polysilicon MEMS Surfaces Using the Sub-Boundary Lubrication Model , 2003 .
[10] Leslie M. Phinney,et al. Repair of stiction-failed surface-micromachined polycrystalline silicon cantilevers using pulsed lasers , 2000 .
[11] Takahashi,et al. EFFECTS OF HELIUM ON BEHAVIOR OF POINT DEFECT PRODUCED BY IRRADIATION IN LOW ACTIVATION Fe-Cr-Mn(W, V) ALLOYS , 2004 .
[12] Y. Bäcklund,et al. Bond‐Strength Measurements Related to Silicon Surface Hydrophilicity , 1992 .
[13] R. D. Blanton,et al. CARAMEL: Contamination And Reliability Analysis of MicroElectromechanical Layout , 1999 .
[14] Michael Hietschold,et al. Parasitic charging of dielectric surfaces in capacitive microelectromechanical systems (MEMS) , 1998 .
[15] L. Luo,et al. Simulation on the encapsulation effect of the high-g shock MEMS accelerometer , 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
[16] Bo E. Sernelius,et al. Comment on “Calculation of the Casimir force between imperfectly conducting plates” , 2000 .
[17] M. Vázquez,et al. Giant magnetoimpedance effect and magnetoelastic properties in stress-annealed FeCuNbSiB nanocrystalline wire , 2002 .
[18] Siak Piang Lim,et al. A neural-network-based method of model reduction for the dynamic simulation of MEMS , 2001 .
[19] Tao Jiang,et al. Particulate failures for surface-micromachined MEMS , 1999, International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034).
[20] Fabrizio Pinto. COMPUTATIONAL CONSIDERATIONS IN THE CALCULATION OF THE CASIMIR FORCE BETWEEN MULTILAYERED SYSTEMS , 2004 .
[21] M.T. Dugger,et al. Measuring and modeling electrostatic adhesion in micromachines , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[22] Michael R. Lovell,et al. A Solution for Lightly Loaded Adhesive Rough Surfaces With Application to MEMS , 2004 .
[23] Kukjin Chun,et al. A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature , 1998 .
[24] Sylvain Petitgrand,et al. Simultaneous mapping of out-of-plane and in-plane vibrations of MEMS with (sub)nanometer resolution , 2004 .
[25] Terry A. Michalske,et al. Accurate method for determining adhesion of cantilever beams , 1999 .
[26] S. Lamoreaux,et al. CALCULATION OF THE CASIMIR FORCE BETWEEN IMPERFECTLY CONDUCTING PLATES , 1999 .
[27] F. P. Bowden,et al. The Friction and Lubrication of Solids , 1964 .
[28] Masayoshi Esashi,et al. Anodic bonding for integrated capacitive sensors , 1992, [1992] Proceedings IEEE Micro Electro Mechanical Systems.
[29] Albert P. Pisano,et al. FEASIBILITY STUDY OF A MEMS VISCOUS ROTARY ENGINE POWER SYSTEM (VREPS) , 2004 .
[30] Jeremy A. Walraven,et al. Electrostatic discharge/electrical overstress susceptibility in MEMS: a new failure mode , 2000, SPIE MOEMS-MEMS.
[31] Jeremy A. Walraven,et al. Introduction to applications and industries for microelectromechanical systems (MEMS) , 2003, International Test Conference, 2003. Proceedings. ITC 2003..
[32] Gerard Ghibaudo,et al. Quasi-breakdown in ultra-thin SiO/sub 2/ films: occurrence characterization and reliability assessment methodology , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).
[33] C. Mastrangelo,et al. A simple experimental technique for the measurement of the work of adhesion of microstructures , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.
[34] Roger T. Howe,et al. Statistical characterization of fracture of brittle MEMS materials , 1999, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[35] Liwei Lin. MEMS post-packaging by localized heating and bonding , 2000 .
[36] Robert Puers,et al. Creep as a reliability problem in MEMS , 2004, Microelectron. Reliab..
[37] Shinji Kobayashi,et al. Double-frame silicon gyroscope packaged under low pressure by wafer bonding (特集 振動型センサ・アクチュエータ) , 2000 .
[38] A. Tseng,et al. Low stress packaging of a micromachined accelerometer , 2001 .
[39] Avinoam Rabinovitch. A note on the amplitude-frequency relation of electromagnetic radiation pulses induced by material failure , 1999 .
[40] S. M. Ali,et al. Investigation of adhesion during operation of MEMS cantilevers , 2003, SPIE MOEMS-MEMS.
[41] Leslie M. Phinney,et al. Effects of temperature on surface adhesion in MEMS structures , 2000, SPIE MOEMS-MEMS.
[42] N. S. Nesmelov,et al. Electrical breakdown in solid dielectrics , 2005 .
[43] Roger T. Howe,et al. The effect of release-etch processing on surface microstructure stiction , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.
[44] Shao-Ming Yu,et al. A unified quantum correction model for nanoscale single- and double-gate MOSFETs under inversion conditions , 2004 .
[45] V. B. Svetovoy,et al. Precise calculation of the Casimir force between gold surfaces , 2000 .
[46] Chang-Da Tsai,et al. Electromigration-induced failure in flip-chip solder joints , 2005 .
[47] Kensall D. Wise,et al. Batch-processed vacuum-sealed capacitive pressure sensors , 2001 .
[48] H. von Känel,et al. Nano-scale defect analysis by BEEM , 2000 .
[49] Brian D. Thoms,et al. Surface oxidation chemistry of β-SiC , 1997 .
[50] Rui Yang,et al. Concentration of point defects and site occupancy behavior in ternary NiAl alloys , 2004 .
[51] I. V. Putilova,et al. Calculations of the abrasive wear of pipelines of the ash and coal dust pneumatic-transport facilities of thermal power stations , 2003 .
[52] J. C. Lee,et al. An electrostatic discharge failure mechanism in semiconductor devices, with applications to electrostatic discharge measurements using transmission line pulsing technique , 2000 .
[53] P. Kladitis,et al. The effects of ionizing radiation on microelectromechanical systems (MEMS) actuators: electrostatic, electrothermal, and bimorph , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.
[54] R. Puers,et al. A physical model to predict stiction in MEMS , 2006 .
[55] Bharat Bhushan,et al. Scale dependence of micro/nano-friction and adhesion of MEMS/NEMS materials, coatings and lubricants , 2004 .
[56] Roland W. Gooch,et al. Low-Cost Wafer-Level Vacuum Packaging for MEMS , 2003 .
[57] A. B. Campbell,et al. The effects of radiation on MEMS accelerometers , 1996 .
[58] Jeremy A. Walraven,et al. MEMS reliability in a vibration environment , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).
[59] Oliver Paul,et al. Mechanical Reliability of MEMS-structures under shock load , 2001, Microelectron. Reliab..
[60] R. Puers,et al. Creep characterization of Al alloy thin films for use in MEMS applications , 2004 .
[61] Bharat Bhushan,et al. A new atomic force microscopy based technique for studying nanoscale friction at high sliding velocities , 2005 .
[62] R. Howe,et al. Critical Review: Adhesion in surface micromechanical structures , 1997 .
[63] A. Jungen,et al. A Study of Creep in Polysilicon MEMS Devices , 2005 .
[64] 赵亚溥. Stiction and anti-stiction in MEMS and NEMS , 2003 .
[65] Maarten P. de Boer,et al. Role of interfacial properties on MEMS performance and reliability , 1999, Industrial Lasers and Inspection.
[66] Ingrid De Wolf,et al. Characterization and failure analysis of MEMS: high resolution optical investigation of small out-of-plane movements and fast vibrations , 2004 .
[67] Robert Puers,et al. Creep-resistant aluminum alloys for use in MEMS , 2005 .
[68] Roya Maboudian,et al. An investigation of sidewall adhesion in MEMS , 2003 .
[69] Ersin Emre Oren,et al. Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures , 2004 .
[70] D. M. Tanner,et al. The effect of humidity on the reliability of a surface micromachined microengine , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).
[71] Pranav Shrotriya,et al. Surface topography evolution and fatigue fracture in polysilicon MEMS structures , 2003 .
[72] Ira Krepchin,et al. Texas Instruments Inc. , 1963, Nature.
[73] Roger T. Howe,et al. Fracture Strength of Polycrystalline Silicon , 1998 .
[74] Michael Pecht,et al. Reliability assessment of a plastic encapsulated RF switching device , 1998 .
[75] Robert Puers,et al. The influence of mechanical shock on the operation of electrostatically driven RF-MEMS switches , 2004 .
[76] Deenesh Padhi,et al. Effect of electron flow direction on model parameters of electromigration-induced failure of copper interconnects , 2003 .
[77] W. Merlijn van Spengen,et al. MEMS reliability from a failure mechanisms perspective , 2003, Microelectron. Reliab..
[78] Yue Kuo,et al. Dielectric relaxation and breakdown detection of doped tantalum oxide high-k thin films , 2004 .
[79] Yu. M. Pochtman,et al. Calculation and rational design of structures subjected to corrosive wear (review) , 1992 .
[80] Long-Sun Huang,et al. MEMS packaging for micro mirror switches , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
[81] T. Michalske,et al. Adhesion of polysilicon microbeams in controlled humidity ambients , 1998 .
[82] S. Choa,et al. Reliability of MEMS packaging: vacuum maintenance and packaging induced stress , 2005 .
[83] R. Maeda,et al. Wideband and high reliability RF-MEMS switches using PZT/HfO/sub 2/ multi-layered high K dielectrics , 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.
[84] S. M. Hu,et al. Critical stress in silicon brittle fracture, and effect of ion implantation and other surface treatments , 1982 .
[85] L. Edmonds,et al. Radiation response of a MEMS accelerometer: an electrostatic force , 1998 .
[86] Jeremy A. Walraven,et al. MEMS reliability in shock environments , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).
[87] Larry Levit,et al. Electrical breakdown and ESD phenomena for devices with nanometer-to-micron gaps , 2003, SPIE MOEMS-MEMS.
[88] L Cândido,et al. Single and paired point defects in a 2D Wigner crystal. , 2001, Physical review letters.
[89] G. Ghibaudo,et al. Review on high-k dielectrics reliability issues , 2005, IEEE Transactions on Device and Materials Reliability.
[90] D. M. Tanner,et al. Wear Mechanisms in a Reliability Methodology , 2003, SPIE MOEMS-MEMS.
[91] T. Chung,et al. A new organic modifier for anti-stiction , 2001 .
[92] Ming C. Wu,et al. G-performance characterization of surface-micromachined FDDI optical bypass switches , 1997, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[93] C. Duvvury,et al. ESD: a pervasive reliability concern for IC technologies , 1993 .
[94] Gabriel A Silva,et al. Introduction to nanotechnology and its applications to medicine. , 2004, Surgical neurology.
[95] A. T. DiBenedetto. The structure and properties of materials , 1967 .
[96] A. Hanneborg,et al. Sodium contamination in integrated MEMS packaged by anodic bonding , 2003, The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE.
[97] Miko Elwenspoek,et al. Static friction in elastic adhesive MEMS contacts, models and experiment , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).
[98] R. Legtenberg,et al. Stiction in surface micromachining , 1996 .
[99] Harald Schenk,et al. Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror , 2004, SPIE MOEMS-MEMS.
[100] R. J. Hanson,et al. Evaluation of EMP Failure Models for Discrete Semiconductor Devices , 1981, IEEE Transactions on Nuclear Science.
[101] João Pedro Conde,et al. MEMS microbridge vibration monitoring using spin-valve sensors , 2002 .