论文信息 - Stability of gold bonding and Ti/Au ohmic contact metallization to n-SiC in high power devices - 字舞流文

Stability of gold bonding and Ti/Au ohmic contact metallization to n-SiC in high power devices

W. Paszkowicz | R. Ratajczak | E. Kamińska | A. Piotrowska | M. Guziewicz | R. Kisiel | K. Gołaszewska | A. Stonert | K. Pągowska | N. Kwietniewski