论文信息 - Design and implementation of 3D-thermal test chip for exploration of package effects - 字舞流文

Design and implementation of 3D-thermal test chip for exploration of package effects

Yung-Fa Chou | D. Kwai | Shih-Chieh Chang | Ping-Hei Chen | Kun-Ju Tsai | Ta‐Wei Lin | Ting-Sheng Chen | Jui-Hung Chien | C. Lung