A newly developed press packed reverse conducting IGBT (RCIGBT), the ST1000EX21, having ratings of 2500 V and 1000 A, has successfully been introduced in high-reliability application areas. A multiple-chip press packed RCIGBT structure, containing IGBT chips and fast recovery diode (FRD) chips, has been achieved by using basic experimental results and a stress analysis using the finite element structure analysis program ABAQUS. Excellent electrical characteristics, especially a robust turn-off capability, such as Ic = 5000 A, Vcp = 2800 V at Tj = 125 °C, have been obtained. High reliability, withstanding a thermal cycling (fatigue) test of more than 50,000 cycles and a high-temperature voltage blocking test for 2000 hours, has been confirmed. The device is now available and is being successfully used for transportation systems and other applications that require high reliability and long-term stability. Voltage and current ratings in IGBTs and IEGTs (Injection Enhanced Gate Transistors) will be raised in the future. © 2000 Scripta Technica, Electr Eng Jpn, 131(1): 78–85, 2000
[1]
Wu-chen Wu,et al.
Investigation on the long term reliability of power IGBT modules
,
1995,
Proceedings of International Symposium on Power Semiconductor Devices and IC's: ISPSD '95.
[2]
Hideo Matsuda,et al.
Pressure contact assembly technology of high power devices
,
1997,
Proceedings of 9th International Symposium on Power Semiconductor Devices and IC's.
[3]
Masahiro Koizumi,et al.
Reliability of thick Al wire bonds in IGBT modules for traction motor drives
,
2000
.
[4]
M. Stoisiek,et al.
A 200-A/2000-V MOS-GTO with improved cell design
,
1992
.
[5]
Wuchen Wu,et al.
Reliability testing and analysis of IGBT power semiconductor modules
,
1995
.