Electromagnetic emissions from the IC packaging

The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results.

[1]  Jun Fan,et al.  Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors , 2010, IEEE Transactions on Electromagnetic Compatibility.

[2]  Jun Fan,et al.  Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters , 2010, IEEE Transactions on Electromagnetic Compatibility.

[3]  Gang Li,et al.  Fundamental components of the IC packaging electromagnetic interference (EMI) analysis , 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

[4]  Jun Fan,et al.  Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.