SPICE-model of multiwall carbon nanotube through-hole vias
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Marcello D'Amore | M. S. Sarto | Alessio Tamburrano | Maria Sabrina Sarto | M. D'amore | A. Tamburrano
[1] Stefan Dickmann,et al. Lumped models for Vias in multilayered PCBs , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.
[2] M. S. Sarto,et al. New Electron-Waveguide-Based Modeling for Carbon Nanotube Interconnects , 2009, IEEE Transactions on Nanotechnology.
[3] Ashok Srivastava,et al. A model of multi-walled carbon nanotube interconnects , 2009, 2009 52nd IEEE International Midwest Symposium on Circuits and Systems.
[4] A. Naeemi,et al. Physical Modeling of Temperature Coefficient of Resistance for Single- and Multi-Wall Carbon Nanotube Interconnects , 2007, IEEE Electron Device Letters.
[5] M. S. Sarto,et al. Multiwall carbon nanotube vias: An effective TL model for EMC oriented analysis , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.
[6] J. Meindl,et al. Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems , 2008, IEEE Transactions on Electron Devices.
[7] Y. E. Yang,et al. Modeling and analysis of vias in multilayered integrated circuits , 1993 .
[8] K. Banerjee,et al. Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects , 2008, IEEE Transactions on Electron Devices.
[9] M. S. Sarto,et al. Electromagnetic modelling of vertical carbon nanotube interconnects , 2006 .
[10] Equivalent single conductor for modeling near field radiated emission of carbon nanotube bundles , 2009, 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO).
[11] M. S. Sarto,et al. Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes , 2010, IEEE Transactions on Nanotechnology.