Ultrasonic complex vibration welding systems of 100 kHz to 200 kHz with large welding tip area for packaging in microelectronics

Ultrasonic complex vibration welding systems of 100 to 200 kHz using a complex vibration welding tip with large area vibrating in elliptical to circular locus were studied. The complex vibration systems have a welding tip part of 21 mm/spl times/21 mm area which is available for direct welding of semiconductor tips of 20 mm square on substrate (face down bonding) and packaging of various electronic devices.

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