Cost-reducing method for HCT slicing

The invention provides a cost-reducing method for HCT slicing, and relates to the technical field of solar silicon wafer cutting. By using the method, a technique is optimized with the overall consideration of procurement costs of a wire, sand and a solution and by adjusting the mortar dosage, the replacing mode, the steel wire dosage of each knifing, the technique parameter, the loading amount and the like. The method comprises the following steps of: adjusting the mortar dosage and the replacing mode: adjusting the mortar dosage to 75-80g/pcs on average, replacing the mortar once every three knifings; adjusting the steel wire dosage; adjusting the full-load steel wire dosage to 430-500km and the half-load steel wire dosage to 330-380km; adjusting the technique parameter: adjusting the full-load cutting table speed to 280-300mum/min and the half-load cutting table speed to 350-390mum/min; adjusting the corresponding steel wire speed according to the steel wire dosage; adjusting the loading amount: setting every three knifings to one cycle, wherein the first knifing is of full load cutting, the second knifing is of half load cutting and the third knifing is of half load cutting. The method has the following beneficial effects that the purposes of reducing the manufacturing cost of a silicon wafer and ensuring the manufacturing quality of the silicon wafer are fulfilled finally by adjusting the mortar dosage, the mortar replacing mode, the steel wire dosage, the parameter of the manufacturing parameter and the loading amount.