Fully coupled dynamic electro-thermal simulation

Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried out by using the industry-standard simulator SABER, therefore for electro-thermal simulations we are able to use the common electrical compact models by adding a heat source and thermal pins to them. The application of this technique and need for electro-thermal simulation is illustrated with the simulation of a current control circuit built into a multiwatt package.

[1]  A. Napieralski,et al.  A new approach to thermal analysis of power devices , 1987, IEEE Transactions on Electron Devices.

[2]  P. R. Gray,et al.  Analysis and design of temperature stabilized substrate integrated circuits , 1974 .

[3]  G. A. Slack,et al.  Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point , 1964 .

[4]  F. Curatelli,et al.  Three-dimensional transient thermal simulation: application to delayed short circuit protection in power ICs , 1980 .

[5]  D. L. Blackburn,et al.  Simulating the dynamic electrothermal behavior of power electronic circuits and systems , 1993 .

[6]  Vladimir A. Koval,et al.  CAD: The numerical and analytical methods combined for the analysis of IC's thermal fields , 1993, Proceedings of EURO-DAC 93 and EURO-VHDL 93- European Design Automation Conference.

[7]  Rinaldo Castello,et al.  Integrated-circuit thermal modeling , 1978 .

[8]  B. Geeraerts,et al.  Electrothermal simulation and design of integrated circuits , 1994, IEEE J. Solid State Circuits.

[9]  A. Bontemps,et al.  Realistic and efficient simulation of electro-thermal effects in VLSI circuits , 1997, IEEE Trans. Very Large Scale Integr. Syst..

[10]  Giacomo M. Bisio,et al.  Characterization of the thermal behaviour in ICs , 1991 .

[11]  Wolfgang Fichtner,et al.  Automatic rectangle-based adaptive mesh generation without obtuse angles , 1992, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[12]  Fabrizio Bonani,et al.  On the application of the Kirchhoff transformation to the steady-state thermal analysis of semiconductor devices with temperature-dependent and piecewise inhomogeneous thermal conductivity , 1995 .

[13]  A. L. Palisoc,et al.  Transient thermal study of semiconductor devices , 1990 .

[14]  Chin C. Lee,et al.  Real-time thermal design of integrated circuit devices , 1988 .

[15]  Andrzej J. Strojwas,et al.  MONSTR: A Complete Thermal Simulator of Electronic Systems , 1994, 31st Design Automation Conference.

[16]  A. Hefner,et al.  Thermal component models for electro-thermal network simulations , 1993 .

[17]  Volker Dr. Dudek,et al.  Lithography-independent nanometer silicon MOSFETs on insulator , 1996 .

[18]  Günter Zimmer,et al.  Dynamic SPICE-simulation of the electrothermal behavior of SOI MOSFET's , 1995 .

[19]  Kenneth E. Mortenson,et al.  Transistor Junction Temperature as a Function of Time , 1957, Proceedings of the IRE.

[20]  Márta Rencz,et al.  Electro-thermal and logi-thermal simulation of VLSI designs , 1997, IEEE Trans. Very Large Scale Integr. Syst..

[21]  P. R. Gray,et al.  Computer simulation of integrated circuits in the presence of electrothermal interaction , 1976 .

[22]  David J. Allstot,et al.  Electrothermal simulation of integrated circuits , 1993 .

[23]  Allen R. Hefner,et al.  A dynamic electro-thermal model for the IGBT , 1992, Conference Record of the 1992 IEEE Industry Applications Society Annual Meeting.

[24]  M. Latif,et al.  Network Analysis Approach to Multidimensional Modeling of Transistors Including Thermal Effects , 1982, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[25]  P. C. Munro,et al.  Simulating the current mirror with a self-heating BJT model , 1991 .