Design of broadband cross-coupled SIW filter based on TSV

This work proposes a broadband substrate-integrated waveguide (SIW) cross-coupling filter that can be applied to fixed and land mobile services in terahertz communications. The filter is designed by a generalized Chebyshev function. The topology of the filter is' J 'topology by combining tandem topology and box topology. Based on this premise, through-silicon via (TSV) technology and SIW structure are used for modeling and simulation through HFSS high frequency simulation software. The filter has a bandwidth of 0.031THz, takes 0.281THz as the central frequency, the insertion loss is 1.5dB, and the reflection coefficient in the passband is higher than 10.8dB.

[1]  Yintang Yang,et al.  A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology , 2021, IEEE Microwave and Wireless Components Letters.

[2]  Yuandan Dong,et al.  A Novel Compact Wide-Stopband Filter With Hybrid Structure by Combining SIW and Microstrip Technologies , 2021, IEEE Microwave and Wireless Components Letters.

[3]  Qing Liu,et al.  A Class of Box-Like Bandpass Filters With Wide Stopband Based on New Dual-Mode Rectangular SIW Cavities , 2021, IEEE Transactions on Microwave Theory and Techniques.

[4]  Yi‐fan Xue,et al.  Compact-Balanced BPF and Filtering Crossover With Intrinsic Common-Mode Suppression Using Single-Layered SIW Cavity , 2020, IEEE Microwave and Wireless Components Letters.

[5]  Yang Liu,et al.  Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Yintang Yang,et al.  High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[7]  Yintang Yang,et al.  Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array , 2017, IEEE Microwave and Wireless Components Letters.

[8]  Huaguo Liang,et al.  Architecture of Cobweb-Based Redundant TSV for Clustered Faults , 2016, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[9]  Ian Hunter,et al.  Synthesis of general Chebyshev characteristic function for dual (single) bandpass filters , 2015, 2015 IEEE MTT-S International Microwave Symposium.