Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications
暂无分享,去创建一个
R. Aschenbrenner | T. Braun | M. Topper | K.-F Becker | I. Ndip | M. Huhn | U. Maass | M. Wilke | K.-D Lang
[1] R. Weigel,et al. A 77 GHz SiGe mixer in an embedded wafer level BGA package , 2008, 2008 58th Electronic Components and Technology Conference.
[2] B. Keser,et al. The Redistributed Chip Package: A Breakthrough for Advanced Packaging , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[4] M. Wojnowski,et al. A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.
[5] H. Reichl,et al. Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology , 2010, IEEE Transactions on Advanced Packaging.
[6] M. Brunnbauer,et al. Embedded Wafer Level Ball Grid Array (eWLB) , 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
[7] A. Cardoso,et al. eWLB SiP with Sn finished passives , 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).