Glasses and glass-ceramics for application in micromechanics

Abstract A photosensitive glass (SiO2 69.3; Al2O3 4.0; Li2O 21.6; Na2O 2.5; K2O 2.5 (mol%) was optimized for microstructuring. Large differences in the etching rate between exposed and unexposed regions and a reduction of the angle of deviation of the etched wall from the surface normal to less than 2° were reached. The deviation from the desired geometry can be minimized by covering and enlargements can be reduced to 1 μm. A XeCl laser was used to form holes with a diameter of 10 μm and a tolerance of ± 1 μm using a one-sided etching technique.