Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications

Ceramic column grid array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short-term and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected nondestructively, and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short- and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from −185°C to +125°C extreme thermal environments. The test hardware consis...