Modeling and Prediction of Electromagnetic Immunity for Integrated Circuits

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

[1]  Xing Zhao,et al.  MIMO Antenna Using Resonance of Ground Planes for 4G Mobile Application , 2013 .

[2]  Taigon Song,et al.  PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[3]  James P. Muccioli,et al.  Characterization of the RF emissions from a family of microprocessors using a 1 GHz TEM cell , 1997, IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113).

[4]  Wansoo Nah,et al.  Electrical Parameter Extraction of High Performance Package Using PEEC Method , 2011 .

[5]  Andy Marvin,et al.  Effect of logic family on radiated emissions from digital circuits , 1998 .

[6]  E. Sicard,et al.  Characterization and modeling of parasitic emission in deep submicron CMOS , 2005, IEEE Transactions on Electromagnetic Compatibility.

[7]  J. L. Prince,et al.  Simultaneous switching ground noise calculation for packaged CMOS devices , 1991 .

[8]  I. Chahine,et al.  Characterization and Modeling of the Susceptibility of Integrated Circuits to Conducted Electromagnetic Disturbances Up to 1 GHz , 2008, IEEE Transactions on Electromagnetic Compatibility.

[9]  Wansoo Nah,et al.  Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN , 2012, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility.

[10]  Soo-Hyung Kim,et al.  Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[11]  R. Perdriau,et al.  A Direct Power Injection Model for Immunity Prediction in Integrated Circuits , 2008, IEEE Transactions on Electromagnetic Compatibility.