Density Upgrading in Tape Automated Bonding
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Bondig technique developed by CII-Honeywell Bull. The paper describes the geometry of bonding pads at the chip level,
the design and realization of the corresponding high density 35 mm tape and the
interconnection of the chips on the tape (inner lead bonding – ILB). Two alternatives of chip mounting
on the substrate are also mentioned.
[1] Jr. A. Blodgett. A Multilayer Ceramic Multichip Module , 1980 .