A planar thermoelectric power generator for integration in wearable microsystems

A technique for IC-compatible fabrication of a planar (in-plane) thermoelectric (TE) power generator using a thermopile composed of n-type bismuth telluride (Bi2Te3) and p-type antimony telluride (Sb2Te3) thin-films is presented. The research demonstrates that the thermal co-evaporation of bismuth/antimony (Bi/Sb) and telluride (Te) is the most suitable deposition technique. The measurements showed TE performance properties of the deposited thin-films that are comparable to those reported for the same materials in the bulk form. The measurements showed absolute values of the Seebeck coefficient in the range 91–248 VK −1 , an electrical resistivity in the 7.6–39.1� m range and a thermal conduction between 1.3 and 1.8 W m−1 K−1. The best resulting figures-of-merit, ZT, at room temperatures were 0.97 and 0.56 (equivalent to power-factors, PF, of 4.87 × 10 −3

[1]  M. Kaviany,et al.  Fabrication and measured performance of a first-generation microthermoelectric cooler , 2005, Journal of Microelectromechanical Systems.

[2]  Luciana W. da Silva,et al.  Miniaturized Thermoelectric Cooler , 2002 .

[3]  Kim-Fung Man,et al.  An optimal fuzzy PID controller , 2001, IEEE Trans. Ind. Electron..

[4]  H. Bottner,et al.  New thermoelectric components using microsystem technologies , 2004, Journal of Microelectromechanical Systems.

[5]  C. B. Vining,et al.  Semiconductors are cool , 2001, Nature.

[6]  G. J. Snyder,et al.  Thermoelectric microdevice fabricated by a MEMS-like electrochemical process , 2003, Nature materials.

[7]  Alain Giani,et al.  Growth of Bi2Te3 and Sb2Te3 thin films by MOCVD , 1999 .

[8]  Gao Min,et al.  Conversion Efficiency of Thermoelectric Combustion Systems , 2007, IEEE Transactions on Energy Conversion.

[9]  Yue Hao,et al.  Thermal transportation simulation of a susceptor structure with ring groove for the vertical MOCVD reactor , 2009 .

[10]  H. Böttner,et al.  Micropelt miniaturized thermoelectric devices: small size, high cooling power densities, short response time , 2005, ICT 2005.

[11]  L. Bell Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems , 2008, Science.

[12]  Refet Firat Yazicioglu,et al.  Ultra-low power biopotential interfaces and their application in wearable and implantable systems , 2007, 2007 2nd International Workshop on Advances in Sensors and Interface.

[13]  D. M. Rowe,et al.  Peltier effect in a co-evaporated Sb2Te3(P)-Bi2Te3(N) thin film thermocouple , 2002 .

[14]  R. Wolffenbuttel,et al.  Design and fabrication of on-chip integrated polySiGe and polySi Peltier devices , 2000 .

[15]  R. Wolffenbuttel,et al.  Thermo-electric characterization of APCVD PolySi/sub 0.7/Ge/sub 0.3/ for IC-compatible fabrication of integrated lateral Peltier elements , 2005, IEEE Transactions on Electron Devices.

[16]  Margaret A. K. Ryan,et al.  Thermoelectric microdevice fabrication process and evaluation at the Jet Propulsion Laboratory (JPL) , 2002, Twenty-First International Conference on Thermoelectrics, 2002. Proceedings ICT '02..

[17]  A. Giani,et al.  Flash evaporated layers of (Bi2Te3–Bi2Se3)(N) and (Bi2Te3–Sb2Te3)(P) , 1998 .