Comparative study on chemical stability of dielectric oxide films under HF wet and vapor etching for radiofrequency microelectromechanical system application
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[1] B. Garrido,et al. The Role of Chemical Species in the Passivation of 〈100〉 Silicon Surfaces by HF in Water‐Ethanol Solutions , 1996 .
[2] D. M. Knotter,et al. Etching mechanism of silicon nitride in HF-based solutions , 2001 .
[3] Sun Jin Yun,et al. PEALD of Zirconium Oxide Using Tetrakis(ethylmethylamino)zirconium and Oxygen , 2004 .
[4] S. Yun,et al. Characteristics of TiO2 Films Prepared by ALD With and Without Plasma , 2004 .
[5] M. Balasubramanian,et al. Wet etching characteristics and surface morphology evaluation of MOCVD grown HfO2 film , 2004 .
[6] D. M. Knotter,et al. Etching Mechanism of Vitreous Silicon Dioxide in HF-Based Solutions , 2000 .
[7] C. R. Helms,et al. Mechanisms of the HF/H2O vapor phase etching of SiO2 , 1992 .
[8] Chun‐Sing Lee,et al. Dry release for surface micromachining with HF vapor-phase etching , 1997 .
[9] R. Wallace,et al. Wet chemical etching studies of Zr and Hf-silicate gate dielectrics , 2002 .
[10] Sun Jin Yun,et al. Electrical Properties of Alumina Films by Plasma-Enhanced Atomic Layer Deposition , 2004 .
[11] H. Baltes,et al. REVIEW ARTICLE: Silicon dioxide sacrificial layer etching in surface micromachining , 1997 .
[12] H. Watanabe,et al. Influence of Water Adsorption/Desorption Processes on the Selectivity of Vapor HF Etching , 1995 .
[13] R. Howe,et al. Critical Review: Adhesion in surface micromechanical structures , 1997 .
[14] Hyung Joun Yoo,et al. Modeling and Characterization of Gas‐Phase Etching of Thermal Oxide and TEOS Oxide Using Anhydrous HF and CH 3 OH , 1996 .
[15] Gabriel M. Rebeiz. RF MEMS: Theory, Design and Technology , 2003 .
[16] J. Bustillo,et al. Surface micromachining for microelectromechanical systems , 1998, Proc. IEEE.
[17] Etching Kinetics of Silicon Dioxide in Aqueous Fluoride Solutions: A Surface Complexation Model , 1996 .