Improvement of microsystem throughput using new cooling system

This paper presents a new possibility of clock freq uency/voltage control in microsystems i.e. high performance processors, exploi ting information about cooling efficiency. In this paper, we propose an approach t hat better exploits the thermal abilities of a chip fixed to cooling system in orde to eliminate its energy accumulation. For the purpose of the proposed method, the calculation of so called time shift (TS) is introduced. TS is defined as the dura tion where the computational system can perform the task at higher frequency withou t any thermal violation when the chip temperature is close to critical thermal t hreshold. The analogy between thermal and electrical parameters allows to model RC thermal compact model of structure (chip fixed to the cooling system). Based on this assumption, the authors compute the TS value versus different parameters us ing RC thermal compact model in Spice environment. The results indicate that TS could fulfil a significant part of die total working time. As an effect the propose d approach may be a means for increasing average clock frequency or voltage suppl y, consequently enhancing the system’s throughput.