Integrating nanowires with substrates using directed assembly and nanoscale soldering

This paper describes a new methodology for integrating nanowires with micropatterned substrates using directed assembly and nanoscale soldering. Nanowires containing ferromagnetic nickel segments were fabricated by electrodeposition in nanoporous membranes. The nanowires were released by dissolution of the membrane and subsequently aligned relative to micropatterned substrates using magnetic field-directed assembly. After assembly, the wires were permanently bonded to the substrates using solder reflow to form low-resistance electrical contacts. This is the first demonstration of the use of nanoscale solder reflow to form low-resistance electrical interconnects between nanowires and substrates, and we demonstrated the utility of the strategy by fabricating a nanowire-based functional analog integrator.

[1]  Paschalis Alexandridis,et al.  One‐, two‐, and three‐dimensional organization of colloidal particles using nonuniform alternating current electric fields , 2002, Electrophoresis.

[2]  M. Bohr,et al.  A 90nm high volume manufacturing logic technology featuring Cu metallization and CDO low-k ILD interconnects on 300 mm wafers , 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

[3]  Thomas E Mallouk,et al.  Nanowires as building blocks for self-assembling logic and memory circuits. , 2002, Chemistry.

[4]  C. Kittel.  Introduction to solid state physics , 1954 .

[5]  Bob Willis,et al.  Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies , 2003 .

[6]  C. Mirkin,et al.  Hybrid organic-inorganic, rod-shaped nanoresistors and diodes. , 2004, Journal of the American Chemical Society.

[7]  B. Martin,et al.  DNA‐Directed Assembly of Gold Nanowires on Complementary Surfaces , 2001 .

[8]  David H Gracias,et al.  Surface tension driven self-assembly of bundles and networks of 200 nm diameter rods using a polymerizable adhesive. , 2004, Langmuir : the ACS journal of surfaces and colloids.

[9]  R. McCreery,et al.  Molecular Electronic Junctions , 2004 .

[10]  John K. Tomfohr,et al.  Reproducible Measurement of Single-Molecule Conductivity , 2001, Science.

[11]  C. R. Martin,et al.  Membrane-Based Synthesis of Nanomaterials , 1996 .

[12]  Nosang V. Myung,et al.  Magnetic Alignment of Nanowires , 2005 .

[13]  Yu Huang,et al.  Integrated nanoscale electronics and optoelectronics: Exploring nanoscale science and technology through semiconductor nanowires , 2005 .

[14]  Peter C. Searson,et al.  Magnetic trapping and self-assembly of multicomponent nanowires , 2002 .

[15]  A. J. Rafanelli,et al.  Solders and soldering , 1964 .

[16]  Hui Liu,et al.  Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry , 2004 .

[17]  A. Pugh.  The art of electronics. 2nd edn: By Paul Horowitz and Winfield Hill. Pp. 1125. Cambridge University Presss. 1989. £29.95, US$49.50 , 1990 .

[18]  Aliasger K. Salem,et al.  Receptor‐Mediated Self‐Assembly of Multi‐Component Magnetic Nanowires , 2004 .