Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Purpose – The purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.Design/methodology/approach – Temperature cycling of Sn‐3.8Ag‐0.7Cu PBGA packages was carried out at two temperature profiles, the first ranging between −55°C and 100°C (TC1) and the second between 0°C and 100°C (TC2). Crack initiation and propagation was analyzed periodically and totally 7,000 cycles were run for TC1 and 14,500 for TC2. Finite element modeling (FEM), for the analysis of strain and stress, was used to corroborate the experimental results.Findings – The paper finds that TC1 had a characteristic life of 5,415 cycles and TC2 of 14,094 cycles, resulting in an acceleration factor of 2.6 between both profiles. Cracks were first visible for TC1, after 2,500 cycles, and only after 4,000 cycles for TC2. The crack propagation rate was faster for TC1 compared to TC2, ...

[1]  Yan Qi,et al.  Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints , 2006, Microelectron. Reliab..

[2]  A. Dasgupta,et al.  Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu , 2005 .

[3]  Eero Ristolainen,et al.  The effect of solder paste composition on the reliability of SnAgCu joints , 2004, Microelectron. Reliab..

[4]  K. N. Subramanian,et al.  Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints , 2007, Microelectron. Reliab..

[5]  Periannan Arulvanan,et al.  Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints , 2006, Microelectron. Reliab..

[6]  Lang Zhou,et al.  EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu , 2006 .

[7]  K. Tu,et al.  Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .

[8]  Honghai Zhang,et al.  Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5 , 2007 .

[9]  Sheng Liu,et al.  The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy , 2007 .

[10]  Johan Liu,et al.  Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[11]  Eero Ristolainen,et al.  Mechanical and microstructural properties of SnAgCu solder joints , 2006 .

[12]  Tao-Chih Chang,et al.  Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance , 2006 .

[13]  Masazumi Amagai,et al.  Mechanical characterization of Sn-Ag-based lead-free solders , 2002, Microelectron. Reliab..

[14]  Paresh Limaye,et al.  Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[15]  Jue Li,et al.  Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests , 2007, Microelectron. Reliab..

[16]  M. Geers,et al.  Thermomechanical fatigue damage evolution in SAC solder joints , 2007 .

[17]  H. T. Chen,et al.  Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling , 2006, Microelectron. Reliab..

[18]  K. Y. Simon Ng,et al.  Microstructure evolution of the Sn-Ag-y%Cu interconnect , 2006, Microelectron. Reliab..

[19]  D. R. Frear,et al.  Solder mechanics : a state of the art assessment , 1991 .

[20]  Kavagi Levis,et al.  Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[21]  F. Mustapha,et al.  An assessment of lead free solder (Sn3.7Ag0.8Cu) wettability , 2002, 4th Electronics Packaging Technology Conference, 2002..

[22]  Y.-L. Shen,et al.  On the failure path in shear-tested solder joints , 2007, Microelectron. Reliab..

[23]  Zhaonian Cheng,et al.  Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering , 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

[24]  Paul Conway.  Solderability testing of alternate component termination materials with lead free solder alloys , 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.

[25]  K. Suganuma.  Advances in lead-free electronics soldering , 2001 .