论文信息 - Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding - 字舞流文

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

Olivier Vendier | Hervé Blanck | Didier Floriot | Sylvain Delage | Santiago Marco | S. Leseduarte | M. Carmona | S. Marco | H. Blanck | J. Puigcorbé | O. Vendier | J. Puigcorbe | Manuel Carmona | C. Devron | S. Delage | S. Leseduarte | C. Devron | D. Floriot

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