Advances in silicon photonics WDM devices

System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.

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