Printed thick-film mechanical microsystems (MEMS)

Abstract: This chapter discusses the use of printed thick-films in mechanical microsystems or MEMS. It considers two types of microsystem, one based on silicon and the other on ceramic materials. Silicon is the most widely used material for MEMS, and there is a wide range of micromachining processes available to fabricate microstructures. Piezoelectric thick-films such as lead zirconate titanate (PZT) have been successfully printed on silicon but there are difficulties with interfacial reactions and compatibilities with some micromachining processes. Nonetheless, several thick-film MEMS have been realised in silicon and these are described in detail. Printing on ceramics is more straightforward but the range of micromachining processes available is much more limited. Alumina and low-temperature co-fired ceramic (LTCC) substrates have been used to realise ceramic MEMS with LTCC offering the potential for quite complex microstructures. Challenges for the technology include improving film properties, printed resolution and compatibility with micromachining processes and fragile microstructures.

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