Failure localization and mechanism analysis in system-on-chip (SOC) using advanced failure analysis techniques

As system-on-chip (SoC) becomes prevalent in the intelligent system applications, the reliability issue of SoC is getting more attention in the design industry. But due to the circuit complexity, the high pin counts and ever increasing operating frequencies, System-on -Chip (SoC) devices drive the most challenging requirements for failure localization and mechanism analysis. PEM (Photon Emission Microscopy) analysis is important for failure analysis as they can help to locate the failed device directly or point out the analysis direction. FIB (Focused Ion Beam) is also a useful tool in failure analysis which could provide cross section on visible defect. This paper presents a typical failure analysis case of the SoC for information processing and control using a 0.13μm process technology. And PEM and FIB are used to help us locate the failure site and analyze the failure mechanism.