CAE를 이용한 비접촉 웨이퍼 이송장치 연구

This paper aimed at the air-pad design of non-contact transfer for wafer. It is focused on precise control for minimization of pneumatic loss, prevention of wafer secession, and reduction of wafer shock during holding the wafer. Analysis are performed at design parameters of path length for hand device injection port, inlet air size, and central out let hole of air pad. The results are analyzed with effective air flow field including lifting force. It is seen that this system adopting the Bernoulli principle can be applied to non-contact transfer line through the capacity results of air pad design and negative pressure distribution by swirl creating flow field.