Thermal analysis for ion beam processing of the unimorph deformable mirror

The unimorph deformable mirror (DM) is favored in the field of synchrotron radiation due to its simple structure, dynamic surface figure and adaptive adjustment. The request of mirror surface accuracy on the synchrotron radiation beam focus can be up to sub-nanometer RMS. Ion beam figuring is a high precision processing method with noncontacting and roughness damage. However, because it belongs to the type of thermal manufacturing, the adhesive layer characteristic is changed and the DM’s figuring accuracy is reduced by the thermal deformation. In this paper, thermal simulation and temperature test of the adhesive during ion beam processing are carried out; The variation law of temperature and thermal stress of the adhesive layer with different ion beam diaphragms and scanning times are obtained. Therefore, the selective guideline for the diaphragm is obtained. With the optimal process parameters, the temperature of the adhesive layer is decreased with the minimum temperature between the glass transition temperature Tg and 1/2 of the Curie temperature Tc.