Cooling problems and thermal issues in high power electronics - a multi faceted design approach

This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice (K. Azar, 8th THERMINIC workshop, 2002). As heat loads increase and system sizes reduce, further innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

[1]  P. Rodgers,et al.  Design challenges for high-performance heat sinks used in microelectronic equipment: evolution and future requirements , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[2]  Sung Jin Kim,et al.  B12-111 Thermal aspects of micro-mechanical engineering , 2003 .

[3]  Yogendra Joshi.  Heat Out of Small Packages , 2001 .

[4]  Masud Behnia,et al.  An Experimental and Computational Study of Heat Transfer in High Power Amplifiers , 2005 .

[5]  W. Nakayama.  Thermal issues in microsystems packaging , 2000 .

[6]  Wataru Nakayama,et al.  A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model , 2004 .

[7]  Wataru Nakayama,et al.  A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of Build-Up Approach to Thermal Analysis of a Benchmark Model , 2003 .

[8]  M. J. Ellsworth,et al.  The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers , 2003 .

[9]  Vincent P. Manno,et al.  Accurate Thermal Characterization Using ode-A Case Study of Plastic Packages , 1995 .

[10]  W. Nakayama,et al.  Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages , 1998 .

[11]  Jihad Y. Hammoud.  Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials , 2003 .

[12]  Valerie Eveloy,et al.  Board-mounted electronic component transient thermal behavior: CFD prediction versus measurement , 2002 .

[13]  R. L. Webb,et al.  Performance and testing of thermal interface materials , 2003, Microelectron. J..

[14]  Wataru Nakayama.  TED-AJ03-566 The Build-up Approach to Combat Complexity and Uncertainties in Thermal Analysis of Compact Electronic Equipment : A JSME Project : , 2003 .

[15]  John Lohan,et al.  A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer , 2000 .

[16]  W. Nakayama,et al.  A novel approach to the design of complex heat transfer systems: portable computer design-a case study , 2001 .

[17]  C. Schaeffer,et al.  On the use of flat heat pipes as thermal spreaders in power electronics cooling , 2002, 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289).

[18]  M. Behnia,et al.  A systematic evaluation of thermal performance of interface materials in high power amplifiers , 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

[19]  Masud Behnia,et al.  B15-013 EXPERIMENTAL AND NUMERICAL EVALUATION OF THE EFFECTS OF COMPONENT PACKAGING ON CONVECTIVE HEAT LOSSES IN A HIGH POWER AMPLIFIER , 2003 .

[20]  A. Bergles,et al.  Thermal Interfacing Techniques for Electronic Equipment—A Perspective , 2003 .

[21]  Masud Behnia,et al.  Numerical Evaluation of High Power Amplifier Heat Sink Design Options , 2003 .

[22]  Masud Behnia,et al.  A comparison of fin geometries for heatsinks in laminar forced convection: Part II -Optimization of staggered plate fin heatsink , 2001 .

[23]  Valerie Eveloy,et al.  An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling , 2003 .

[24]  Vadim Gektin,et al.  Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications , 2003 .

[25]  Masud Behnia,et al.  Comparison of TISE and SITE heatsinks - A numerical study , 2001 .

[26]  Wataru Nakayama,et al.  A methodology to work on geometrically complex heat transfer systems: the cases of heat conduction through composite slabs , 2003 .

[27]  Cullen E. Bash,et al.  Dynamic Characterization of Thermal Interface Material for Electronic Cooling , 2003 .

[28]  Yogendra K. Joshi,et al.  Orientation independent two-phase heat spreaders for space constrained applications , 2003, Microelectron. J..