Thermokinetic study of intermetallic phase formation in an Al/Cu multilayer thin film system
暂无分享,去创建一个
M. Volochaev | L. Solovyov | S. Zharkov | V. Yumashev | R. R. Altunin | E. T. Moiseenko | O. Belousov
[1] O. V. Belousov,et al. Solid-State Reaction in Cu/a-Si Nanolayers: A Comparative Study of STA and Electron Diffraction Data , 2022, Materials.
[2] C. Adelmann,et al. Aluminide intermetallics for advanced interconnect metallization: thin film studies , 2021, 2021 IEEE International Interconnect Technology Conference (IITC).
[3] Xing Li,et al. Study on diffusion characteristics of Al-Cu systems and mechanical properties of intermetallics , 2021 .
[4] M. Volochaev,et al. Kinetic study of a solid-state reaction in Ag/Al multilayer thin films by in situ electron diffraction and simultaneous thermal analysis , 2021 .
[5] M. Volochaev,et al. Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films , 2021, JOM.
[6] Alan K. Burnham,et al. ICTAC Kinetics Committee recommendations for analysis of multi-step kinetics , 2020 .
[7] S. Zharkov,et al. Effect of the Structural Properties on the Electrical Resistivity of the Al/Ag Thin Films during the Solid-State Reaction , 2020 .
[8] S. Zharkov,et al. In Situ Electron Diffraction and Resistivity Characterization of Solid State Reaction Process in Cu/Al Bilayer Thin Films , 2020, Metallurgical and Materials Transactions A.
[9] S. Zharkov,et al. Structural Phase Transformations during a Solid-State Reaction in a Bilayer Al/Fe Thin-Film Nanosystem , 2020 .
[10] S. Zharkov,et al. In Situ Electron Diffraction Investigation of Solid State Synthesis of Co-In2O3 Ferromagnetic Nanocomposite Thin Films , 2019, JOM.
[11] D. Mishra,et al. A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles , 2019, Journal of Electronic Materials.
[12] D. Ando,et al. CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices , 2019, Journal of Vacuum Science & Technology B.
[13] S. Zharkov,et al. L10 ordered phase formation at solid state reactions in Cu/Au and Fe/Pd thin films , 2019, Journal of Solid State Chemistry.
[14] S. Zharkov,et al. Structural Phase Transformations in Al/Pt Bilayer Thin Films during the Solid-State Reaction , 2018, Physics of the Solid State.
[15] Chen Gong,et al. Lithography‐Free, Omnidirectional, CMOS‐Compatible AlCu Alloys for Thin‐Film Superabsorbers , 2018 .
[16] S. Zharkov,et al. Formation of the atomically ordered L10 structure with the [001] orientation during the solid-state reaction in Fe/Pd bilayer thin films , 2017 .
[17] Z. Jian,et al. Formation and growth of Cu–Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites , 2016 .
[18] M. Soltanieh,et al. Intermetallic Phase Formation in Explosively Welded Al/Cu Bimetals , 2016, Metallurgical and Materials Transactions B.
[19] G. Bondarenko,et al. Thermite synthesis and characterization of Co–ZrO2ferromagnetic nanocomposite thin films , 2016 .
[20] V. L. Acoff,et al. New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study , 2016 .
[21] G. Bondarenko,et al. Solid state synthesis and characterization of Fe–ZrO2 ferromagnetic nanocomposite thin films , 2015 .
[22] R. Bauer,et al. Growth and reactivity of Al-Cu intermetallic compounds under ideal conditions , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[23] V. S. Zhigalov,et al. Study of solid-state reactions and order-disorder transitions in Pd/α-Fe(001) thin films , 2014 .
[24] Z. Xue,et al. Intermediate layer characterization and fracture behavior of laser-welded copper/aluminum metal joints , 2014 .
[25] Rui Huang,et al. Growth kinetics of individual Al-Cu intermetallic compounds , 2014, IEEE International Interconnect Technology Conference.
[26] S. Varnakov,et al. Solid-State Reactions in Fe/Si Multilayer Nanofilms , 2014 .
[27] D. Mangelinck,et al. Investigation of reactive phase formation in the Al–Cu thin film systems , 2012 .
[28] Elena Moukhina,et al. Determination of kinetic mechanisms for reactions measured with thermoanalytical instruments , 2012, Journal of Thermal Analysis and Calorimetry.
[29] Vadim V. Silberschmidt,et al. Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds , 2011 .
[30] Alan K. Burnham,et al. ICTAC Kinetics Committee recommendations for performing kinetic computations on thermal analysis data , 2011 .
[31] G. Qiao,et al. Intermetallic phase formation in diffusion-bonded Cu/Al laminates , 2011 .
[32] V. Sosa,et al. AlCu alloy films prepared by the thermal diffusion technique , 2010 .
[33] W. Hwang,et al. Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints , 2007 .
[34] H. L. Friedman,et al. Kinetics of thermal degradation of char-forming plastics from thermogravimetry. Application to a phenolic plastic , 2007 .
[35] Seung-Boo Jung,et al. Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing , 2005 .
[36] E. Kaisersberger,et al. Model-free analysis of thermoanalytical data-advantages and limitations , 2002 .
[37] Deliang Zhang,et al. Solid state reactions in nanometer scaled diffusion couples prepared using high energy ball milling , 2001 .
[38] J. Opfermann,et al. Kinetic Analysis Using Multivariate Non-linear Regression. I. Basic concepts , 2000 .
[39] André Vantomme,et al. Compound phase formation in thin film structures , 1999 .
[40] J. Dai,et al. INTERFACIAL REACTIONS ON ANNEALING CU/AL MULTILAYER THIN-FILMS , 1993 .
[41] F. W. Saris,et al. Prediction of phase formation sequence and phase stability in binary metal-aluminum thin-film systems using the effective heat of formation rule , 1991 .
[42] J. L. Murray,et al. The aluminium-copper system , 1985 .
[43] King-Ning Tu,et al. Interdiffusion in copper–aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation , 1983 .
[44] K. Tu,et al. Motion of W marker during sequential compound formation in bimetallic AlCu thin films , 1983 .
[45] C. Bauer,et al. Investigation of interdiffusion in thin film couples of aluminum and copper by Auger electron spectroscopy , 1979 .
[46] S. U. Campisano,et al. Growth kinetics of the θ phase in AlCu thin film bilayers , 1978 .
[47] B. I. Fomin,et al. Investigation of diffusion in the CuAl thin film system , 1977 .
[48] Katsuya Watanabe,et al. Interdiffusion in the Al–Cu System , 1971 .
[49] H. E. Kissinger. Reaction Kinetics in Differential Thermal Analysis , 1957 .
[50] A. Smigelskas. Zinc diffusion in alpha brass , 1947 .