Thermokinetic study of intermetallic phase formation in an Al/Cu multilayer thin film system

[1]  O. V. Belousov,et al.  Solid-State Reaction in Cu/a-Si Nanolayers: A Comparative Study of STA and Electron Diffraction Data , 2022, Materials.

[2]  C. Adelmann,et al.  Aluminide intermetallics for advanced interconnect metallization: thin film studies , 2021, 2021 IEEE International Interconnect Technology Conference (IITC).

[3]  Xing Li,et al.  Study on diffusion characteristics of Al-Cu systems and mechanical properties of intermetallics , 2021 .

[4]  M. Volochaev,et al.  Kinetic study of a solid-state reaction in Ag/Al multilayer thin films by in situ electron diffraction and simultaneous thermal analysis , 2021 .

[5]  M. Volochaev,et al.  Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films , 2021, JOM.

[6]  Alan K. Burnham,et al.  ICTAC Kinetics Committee recommendations for analysis of multi-step kinetics , 2020 .

[7]  S. Zharkov,et al.  Effect of the Structural Properties on the Electrical Resistivity of the Al/Ag Thin Films during the Solid-State Reaction , 2020 .

[8]  S. Zharkov,et al.  In Situ Electron Diffraction and Resistivity Characterization of Solid State Reaction Process in Cu/Al Bilayer Thin Films , 2020, Metallurgical and Materials Transactions A.

[9]  S. Zharkov,et al.  Structural Phase Transformations during a Solid-State Reaction in a Bilayer Al/Fe Thin-Film Nanosystem , 2020 .

[10]  S. Zharkov,et al.  In Situ Electron Diffraction Investigation of Solid State Synthesis of Co-In2O3 Ferromagnetic Nanocomposite Thin Films , 2019, JOM.

[11]  D. Mishra,et al.  A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles , 2019, Journal of Electronic Materials.

[12]  D. Ando,et al.  CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices , 2019, Journal of Vacuum Science & Technology B.

[13]  S. Zharkov,et al.  L10 ordered phase formation at solid state reactions in Cu/Au and Fe/Pd thin films , 2019, Journal of Solid State Chemistry.

[14]  S. Zharkov,et al.  Structural Phase Transformations in Al/Pt Bilayer Thin Films during the Solid-State Reaction , 2018, Physics of the Solid State.

[15]  Chen Gong,et al.  Lithography‐Free, Omnidirectional, CMOS‐Compatible AlCu Alloys for Thin‐Film Superabsorbers , 2018 .

[16]  S. Zharkov,et al.  Formation of the atomically ordered L10 structure with the [001] orientation during the solid-state reaction in Fe/Pd bilayer thin films , 2017 .

[17]  Z. Jian,et al.  Formation and growth of Cu–Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites , 2016 .

[18]  M. Soltanieh,et al.  Intermetallic Phase Formation in Explosively Welded Al/Cu Bimetals , 2016, Metallurgical and Materials Transactions B.

[19]  G. Bondarenko,et al.  Thermite synthesis and characterization of Co–ZrO2ferromagnetic nanocomposite thin films , 2016 .

[20]  V. L. Acoff,et al.  New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study , 2016 .

[21]  G. Bondarenko,et al.  Solid state synthesis and characterization of Fe–ZrO2 ferromagnetic nanocomposite thin films , 2015 .

[22]  R. Bauer,et al.  Growth and reactivity of Al-Cu intermetallic compounds under ideal conditions , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

[23]  V. S. Zhigalov,et al.  Study of solid-state reactions and order-disorder transitions in Pd/α-Fe(001) thin films , 2014 .

[24]  Z. Xue,et al.  Intermediate layer characterization and fracture behavior of laser-welded copper/aluminum metal joints , 2014 .

[25]  Rui Huang,et al.  Growth kinetics of individual Al-Cu intermetallic compounds , 2014, IEEE International Interconnect Technology Conference.

[26]  S. Varnakov,et al.  Solid-State Reactions in Fe/Si Multilayer Nanofilms , 2014 .

[27]  D. Mangelinck,et al.  Investigation of reactive phase formation in the Al–Cu thin film systems , 2012 .

[28]  Elena Moukhina,et al.  Determination of kinetic mechanisms for reactions measured with thermoanalytical instruments , 2012, Journal of Thermal Analysis and Calorimetry.

[29]  Vadim V. Silberschmidt,et al.  Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds , 2011 .

[30]  Alan K. Burnham,et al.  ICTAC Kinetics Committee recommendations for performing kinetic computations on thermal analysis data , 2011 .

[31]  G. Qiao,et al.  Intermetallic phase formation in diffusion-bonded Cu/Al laminates , 2011 .

[32]  V. Sosa,et al.  AlCu alloy films prepared by the thermal diffusion technique , 2010 .

[33]  W. Hwang,et al.  Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints , 2007 .

[34]  H. L. Friedman,et al.  Kinetics of thermal degradation of char-forming plastics from thermogravimetry. Application to a phenolic plastic , 2007 .

[35]  Seung-Boo Jung,et al.  Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing , 2005 .

[36]  E. Kaisersberger,et al.  Model-free analysis of thermoanalytical data-advantages and limitations , 2002 .

[37]  Deliang Zhang,et al.  Solid state reactions in nanometer scaled diffusion couples prepared using high energy ball milling , 2001 .

[38]  J. Opfermann,et al.  Kinetic Analysis Using Multivariate Non-linear Regression. I. Basic concepts , 2000 .

[39]  André Vantomme,et al.  Compound phase formation in thin film structures , 1999 .

[40]  J. Dai,et al.  INTERFACIAL REACTIONS ON ANNEALING CU/AL MULTILAYER THIN-FILMS , 1993 .

[41]  F. W. Saris,et al.  Prediction of phase formation sequence and phase stability in binary metal-aluminum thin-film systems using the effective heat of formation rule , 1991 .

[42]  J. L. Murray,et al.  The aluminium-copper system , 1985 .

[43]  King-Ning Tu,et al.  Interdiffusion in copper–aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation , 1983 .

[44]  K. Tu,et al.  Motion of W marker during sequential compound formation in bimetallic AlCu thin films , 1983 .

[45]  C. Bauer,et al.  Investigation of interdiffusion in thin film couples of aluminum and copper by Auger electron spectroscopy , 1979 .

[46]  S. U. Campisano,et al.  Growth kinetics of the θ phase in AlCu thin film bilayers , 1978 .

[47]  B. I. Fomin,et al.  Investigation of diffusion in the CuAl thin film system , 1977 .

[48]  Katsuya Watanabe,et al.  Interdiffusion in the Al–Cu System , 1971 .

[49]  H. E. Kissinger Reaction Kinetics in Differential Thermal Analysis , 1957 .

[50]  A. Smigelskas Zinc diffusion in alpha brass , 1947 .