Power Semiconductor Device Figure of Merit for High-Power-Density Converter Design Applications

In order to help device selection and optimal application in high-power-density converter designs, a new power semiconductor device figure of merit (FOM)-power density FOM-is proposed, with consideration of power device conduction and switching losses, thermal characteristics, and package. The FOM is derived based on the device theory, and its validity and usefulness are demonstrated with a practical design example.

[1]  W. Shen,et al.  Design and Implementation of High Power Density Three-Level Parallel Resonant Converter for Capacitor Charger , 2007, APEC 07 - Twenty-Second Annual IEEE Applied Power Electronics Conference and Exposition.

[2]  A. Huang New unipolar switching power device figures of merit , 2004, IEEE Electron Device Letters.

[3]  Tatsuo Sakai,et al.  New power device figure of merit for high-frequency applications , 1995, Proceedings of International Symposium on Power Semiconductor Devices and IC's: ISPSD '95.

[4]  H. Kirihata,et al.  Developments in modern high power semiconductor devices , 1993, [1993] Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs.

[5]  B. J. Baliga,et al.  Device Figure of Merit for High-Frequency Applications , 1989 .

[6]  B. J. Baliga,et al.  Power semiconductor device figure of merit for high-frequency applications , 1989, IEEE Electron Device Letters.

[7]  B. J. Baliga,et al.  Semiconductors for high‐voltage, vertical channel field‐effect transistors , 1982 .