A low-cost DC-to-92 GHz broadband three-path bondwire interconnect

This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm CMOS chip to a Glass-Integrated-Passive-Device (GIPD) carrier is designed to verify the idea. Measured results of three samples show that the insertion loss and return loss can be better than 3 dB and 11.2 dB from DC up to 92 GHz.

[1]  T. P. Budka,et al.  Wide-bandwidth millimeter-wave bond-wire interconnects , 2001 .

[2]  Chung-Yu Wu,et al.  A Novel Transmission-Line Deembedding Technique for RF Device Characterization , 2009, IEEE Transactions on Electron Devices.

[3]  Yaoming Sun,et al.  An on-board differential Bunny - Ear Antenna design for 60 GHz applications , 2010, German Microwave Conference Digest of Papers.

[4]  Chun-Lin Ko,et al.  A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration , 2013, IEEE Transactions on Microwave Theory and Techniques.

[5]  T. Zwick,et al.  Design and measurement of matched wire bond and flip chip interconnects for D-band system-in-package applications , 2011, 2011 IEEE MTT-S International Microwave Symposium.

[6]  Chun-Lin Ko,et al.  A low-cost broadband bondwire interconnect for heterogeneous system integration , 2013, 2013 IEEE MTT-S International Microwave Symposium Digest (MTT).

[7]  Tzu-Chao Yan,et al.  A low-cost broadband bondwire interconnect for THz heterogeneous system integration , 2015, 2015 IEEE MTT-S International Microwave Symposium.